8541.59.00.40 - Unmounted chips, dice and wafers 🖩

This HTS category, 8541.59.00.40, encompasses unmounted semiconductor chips, dice, and wafers that do not fit into more specific subheadings within 8541.59. These items are the raw, unpackaged forms of semiconductor devices, essentially the fundamental building blocks before they are integrated into larger electronic assemblies or packaged for end-use. This includes bare silicon wafers with integrated circuits, individual semiconductor dies that have been separated from a wafer, and other unmounted semiconductor elements not specifically covered elsewhere.

Distinguishing this category from its sibling, 8541.59.00.80, hinges on the precise nature of the "other" semiconductor devices. While both fall under the broad umbrella of "other semiconductor devices," this particular subheading is for the unmounted forms. The sibling category likely covers other unmounted semiconductor devices that do not meet the specific criteria for being classified as chips, dice, or wafers, or perhaps other related unmounted components not explicitly defined here. The key differentiator is the recognized form factor of the semiconductor material.

As a leaf node, this classification does not have further subcategories. Therefore, the focus for classification under 8541.59.00.40 rests on the definitive identification of the goods as unmounted semiconductor chips, dice, or wafers. Importers and exporters should ensure that the items in question are indeed presented in this raw, unpackaged state and are not yet incorporated into any form of module, panel, or finished electronic component to correctly apply this subheading.