8541.49.70.40 - Unmounted chips, dice and wafers 🖩

This HTS category, 8541.49.70.40, specifically classifies unmounted chips, dice, and wafers that fall within the broader scope of semiconductor devices. These are the fundamental building blocks of integrated circuits and other semiconductor-based components before they are assembled into larger modules or finished products. The defining characteristic is their unmounted state, meaning they are individual, unpackaged semiconductor elements intended for further processing or integration.

This classification is distinguished from its sibling category, 8541.49.70.80 "Other," by its precise focus on these raw semiconductor forms. While the "Other" category would encompass any unmounted semiconductor devices not specifically enumerated elsewhere within the 8541.49.70 subheadings, this category is dedicated solely to chips, dice, and wafers. The distinction is crucial for accurate tariff application, ensuring these foundational semiconductor materials are correctly identified and processed.

As a leaf node, this category does not have further subcategories. Therefore, the focus is on understanding the practical application of this classification. Importers and exporters should ensure that the goods being declared precisely match the description of unmounted semiconductor elements. This includes verifying that the items are indeed individual semiconductor chips, diced portions of a wafer, or complete wafers that have not yet undergone further assembly or packaging into a functional device.