8541.49.10.10 - Unmounted chips, dice and wafers 🖩

This HTS category, 8541.49.10.10, specifically covers unmounted semiconductor chips, dice, and wafers that are designed for use in photosensitive semiconductor devices or light-emitting diodes (LEDs). These are raw, undiced semiconductor material or individual semiconductor elements before they have been packaged or integrated into a larger functional unit. This includes components that will ultimately function as photovoltaic cells or other light-sensitive elements, as well as those intended for LED applications. The key characteristic is that these are the fundamental, unpackaged semiconductor elements.

This classification is distinct from its sibling category, 8541.49.10.50, which covers "Other" photosensitive semiconductor devices and LEDs. While this node focuses on the unmounted, raw semiconductor material (chips, dice, and wafers), the sibling category would encompass photosensitive semiconductor devices or LEDs that have undergone further processing, such as being mounted on a substrate, encapsulated, or assembled into modules or panels, but are not yet complete finished products. Therefore, the primary distinction lies in the degree of processing and packaging.

As this is a leaf node within the HTS, there are no further subcategories. Classification under 8541.49.10.10 is determined by the physical form of the semiconductor (unmounted chip, die, or wafer) and its intended function within the broader scope of photosensitive semiconductor devices or LEDs as defined in heading 8541. The classification hinges on the component being in its raw, unpackaged state, prior to its incorporation into a more complex electronic assembly or finished device.