8541.29.00.40 - Unmounted chips, dice and wafers

This HTS category, 8541.29.00.40, specifically covers unmounted semiconductor chips, dice, and wafers that are not transistors or photosensitive devices. This includes the raw silicon or other semiconductor material in a disc or wafer form, as well as individual chips that have been cut from these wafers but have not yet been packaged or assembled into a functional component. The key defining characteristic is their unmounted state, meaning they are not integrated into any circuitry or housed within protective casings.

Distinguishing this category from its sibling, which is also labeled "Other" at this level but likely pertains to a different, unspecified type of semiconductor device not covered by the preceding narrower classifications, is crucial. Our focus here is solely on the unmounted form of semiconductor material. If there were subcategories, they would likely delineate different types of unmounted semiconductor material based on their intended function or material composition. However, as this is a leaf node, the classification is complete at this level.