8541.21.00.40 - Unmounted chips, dice and wafers 🖩

This HTS code classification pertains to unmounted semiconductor chips, dice, and wafers specifically designed for use as transistors with a power dissipation rate of less than 1 Watt. This means the primary function of these semiconductor devices is amplification or switching of electrical signals, and they are characterized by their ability to handle low power levels without exceeding thermal limits. The "unmounted" aspect signifies that these are individual components, not integrated into a larger assembly or device, and are typically in a raw or processed wafer form before being cut into individual dice or chips.

This category is distinct from its sibling category, "Other," which would encompass transistors with a dissipation rate of 1 Watt or greater, or transistors not meeting the specific criteria for low dissipation. Furthermore, it is important to differentiate these transistors from semiconductor-based transducers and photosensitive semiconductor devices, which have different functional purposes and are classified elsewhere within the broader heading.

As this is a leaf node in the HTS classification, there are no further subcategories. Therefore, the classification hinges on accurately identifying the component as an unmounted transistor with a power dissipation rate strictly below 1 Watt. Examples of goods that would fall under this code include individual silicon or germanium transistor dice intended for use in low-power electronic circuits, or wafers containing multiple such transistor dice that have not yet been separated or packaged.