8532.21.00.40 - Dipped 🖩
Details
| Field | Value |
|---|---|
| Unit of Quantity | No. |
| General Rate of Duty (Column 1 - General) | Free |
| Special Rate of Duty (Column 1 - Special) | N/A |
| Column 2 Rate of Duty | 35% |
| Quota Quantity | N/A |
| Additional Duties | N/A |
Overview
This HTS classification, 8532.21.00.40, specifically covers fixed tantalum capacitors that are of the "Dipped" type. Tantalum capacitors are known for their high capacitance in a small volume and excellent stability. The "dipped" characteristic refers to the manufacturing process where the capacitor element is encapsulated or coated in a protective epoxy resin, often by dipping the component into molten resin. This method provides insulation and protection against environmental factors.
The distinction between this category and its siblings lies in the specific physical form factor and application method. While 8532.21.00.50 covers tantalum capacitors designed for surface mounting (SMD), this category is for those with a different construction and mounting strategy. 8532.21.00.80, "Other," would encompass any fixed tantalum capacitors that do not fit the "dipped" or "surface mounting" criteria, such as those with different encapsulation methods or termination styles.
As a leaf node, 8532.21.00.40 does not have further subdivisions. Therefore, the focus for classification within this code is on confirming that the fixed tantalum capacitor in question is indeed manufactured using a dipping process for its encapsulation, distinguishing it from other types of fixed tantalum capacitors. This ensures accurate tariff application based on the manufacturing method and physical characteristics of the component.