8486.40.00.20 - For assembling semiconductor devices or electronic integrated circuits

This HTS category, 8486.40.00.20, specifically covers machinery and apparatus designed for the assembly of semiconductor devices or electronic integrated circuits. This includes equipment used in processes such as wire bonding, die attach, packaging, and encapsulation, which are critical steps in transforming individual semiconductor components into functional integrated circuits. The primary function of these machines is to physically combine or connect various elements to create the final semiconductor product.

Distinguishing this category from its siblings, 8486.40.00.10 focuses on machinery for creating or repairing masks and reticles, which are used in photolithography for semiconductor manufacturing but are not directly involved in the assembly of the devices themselves. Similarly, 8486.40.00.30 pertains to handling and transfer equipment for various semiconductor-related items, rather than the machinery that performs the actual assembly operations. Therefore, the defining characteristic of 8486.40.00.20 is its role in the active assembly of semiconductor devices and integrated circuits.

As this is a leaf node within the HTS, there are no further subdivisions. Classification within this category is determined by the specific function of the machinery in the assembly process of semiconductor devices or electronic integrated circuits. This means that any machine directly performing operations that connect, affix, or enclose these components falls under this heading, provided it is not primarily designed for mask production or material handling.