8486.20.00.00 - Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits

HTS code 8486.20.00.00 specifically encompasses machines and apparatus designed for the direct manufacture of semiconductor devices and electronic integrated circuits (ICs). This category is distinct from its siblings, such as 8486.10.00.00, which is limited to equipment for producing semiconductor boules or wafers, and 8486.30.00.00, which covers machinery for manufacturing flat panel displays. While 8486.40.00 addresses machinery specified under note 11(C) and 8486.90.00.00 pertains to parts and accessories for the broader group, 8486.20.00.00 focuses solely on the apparatus that performs the fabrication steps on semiconductor materials to create functional devices and complex ICs.

This classification includes a wide array of specialized equipment. Examples encompass wafer probing machines, die bonding apparatus, wire bonding machines, encapsulation equipment for semiconductor packaging, and assembly machines for integrated circuits. The key determinant for classification under this heading is the primary function of the machinery: to process or assemble components to create semiconductor devices or electronic integrated circuits.

As this is a leaf node within the HTS structure, there are no further subcategories. Therefore, the classification relies on accurately identifying the goods as machines or apparatus whose principal use is in the manufacture of semiconductor devices or electronic integrated circuits, distinguishing them from upstream processes (wafer production) or downstream processes (display manufacturing), or general components.