8480.71.40.00 - For the manufacture of semiconductor devices 🖩

This classification covers molds specifically designed for the injection or compression molding of plastics, intended for the manufacture of semiconductor devices. These molds are precision-engineered to produce the intricate shapes and features required for components within the semiconductor industry, such as wafer carriers, packaging molds, or fixtures used in semiconductor fabrication processes. The critical aspect for classification here is the intended end-use in semiconductor manufacturing, dictating a high degree of precision and specialized design.

This category is distinct from its sibling, 8480.71.10.00, which exclusively covers molds for shoe machinery. While both fall under injection or compression types, the latter's focus on footwear production differentiates it significantly. The other sibling category, 8480.71.80, serves as a residual category for injection or compression molds not specifically designated for shoe machinery or semiconductor device manufacturing.

As a leaf node, this category represents the most specific level of classification for these specialized molds. Classification within 8480.71.40.00 hinges on the explicit purpose of producing components for semiconductor devices. Importers and exporters should ensure that the intended application of the mold aligns with this specific designation to ensure accurate customs declarations.