๐Ÿ’พ Data Updated: 2025 HTS Revision 30 โ€ข Last updated: November 24, 2025

7410.22.00.00 - Of copper alloys

Details

FieldValue
Unit of Quantitykg
General Rate of Duty1.5%
Special Rate of DutyFree (A*,AU,BH,CL,CO,D,E,IL,JO,JP,KR,MA,OM,P,PA,PE,S,SG)
AU ๐Ÿ‡ฆ๐Ÿ‡บ
BH ๐Ÿ‡ง๐Ÿ‡ญ
CL ๐Ÿ‡จ๐Ÿ‡ฑ
CO ๐Ÿ‡จ๐Ÿ‡ด
D ๐Ÿ‡ฆ๐Ÿ‡ด ๐Ÿ‡ง๐Ÿ‡ฏ ๐Ÿ‡ง๐Ÿ‡ผ ๐Ÿ‡ง๐Ÿ‡ซ ๐Ÿ‡จ๐Ÿ‡ป ๐Ÿ‡จ๐Ÿ‡ซ ๐Ÿ‡น๐Ÿ‡ฉ ๐Ÿ‡ฐ๐Ÿ‡ฒ ๐Ÿ‡จ๐Ÿ‡ฎ ๐Ÿ‡จ๐Ÿ‡ฉ ๐Ÿ‡ฉ๐Ÿ‡ฏ ๐Ÿ‡ธ๐Ÿ‡ฟ ๐Ÿ‡ช๐Ÿ‡น ๐Ÿ‡ฌ๐Ÿ‡ฆ ๐Ÿ‡ฌ๐Ÿ‡ฒ ๐Ÿ‡ฌ๐Ÿ‡ญ ๐Ÿ‡ฌ๐Ÿ‡ณ ๐Ÿ‡ฌ๐Ÿ‡ผ ๐Ÿ‡ฐ๐Ÿ‡ช ๐Ÿ‡ฑ๐Ÿ‡ธ ๐Ÿ‡ฑ๐Ÿ‡ท ๐Ÿ‡ฒ๐Ÿ‡ฌ ๐Ÿ‡ฒ๐Ÿ‡ผ ๐Ÿ‡ฒ๐Ÿ‡ฑ ๐Ÿ‡ฒ๐Ÿ‡บ ๐Ÿ‡ฒ๐Ÿ‡ฟ ๐Ÿ‡ณ๐Ÿ‡ฆ ๐Ÿ‡ณ๐Ÿ‡ช ๐Ÿ‡ณ๐Ÿ‡ฌ ๐Ÿ‡จ๐Ÿ‡ฌ ๐Ÿ‡ท๐Ÿ‡ผ ๐Ÿ‡ธ๐Ÿ‡ณ ๐Ÿ‡ธ๐Ÿ‡ฑ ๐Ÿ‡ฟ๐Ÿ‡ฆ ๐Ÿ‡ธ๐Ÿ‡น ๐Ÿ‡น๐Ÿ‡ฟ ๐Ÿ‡น๐Ÿ‡ฌ ๐Ÿ‡บ๐Ÿ‡ฌ ๐Ÿ‡ฟ๐Ÿ‡ฒ
E ๐Ÿ‡ฆ๐Ÿ‡ฌ ๐Ÿ‡ฆ๐Ÿ‡ผ ๐Ÿ‡ง๐Ÿ‡ธ ๐Ÿ‡ง๐Ÿ‡ง ๐Ÿ‡ง๐Ÿ‡ฟ ๐Ÿ‡ป๐Ÿ‡ฌ ๐Ÿ‡จ๐Ÿ‡ผ ๐Ÿ‡ฉ๐Ÿ‡ฒ ๐Ÿ‡ฌ๐Ÿ‡ฉ ๐Ÿ‡ฌ๐Ÿ‡พ ๐Ÿ‡ญ๐Ÿ‡น ๐Ÿ‡ฏ๐Ÿ‡ฒ ๐Ÿ‡ฒ๐Ÿ‡ธ NE ๐Ÿ‡ฐ๐Ÿ‡ณ ๐Ÿ‡ฑ๐Ÿ‡จ ๐Ÿ‡ป๐Ÿ‡จ ๐Ÿ‡น๐Ÿ‡น
IL ๐Ÿ‡ฎ๐Ÿ‡ฑ
JO ๐Ÿ‡ฏ๐Ÿ‡ด
JP ๐Ÿ‡ฏ๐Ÿ‡ต
KR ๐Ÿ‡ฐ๐Ÿ‡ท
MA ๐Ÿ‡ฒ๐Ÿ‡ฆ
OM ๐Ÿ‡ด๐Ÿ‡ฒ
P ๐Ÿ‡จ๐Ÿ‡ท ๐Ÿ‡ฉ๐Ÿ‡ด ๐Ÿ‡ธ๐Ÿ‡ป ๐Ÿ‡ฌ๐Ÿ‡น ๐Ÿ‡ญ๐Ÿ‡ณ ๐Ÿ‡ณ๐Ÿ‡ฎ
PA ๐Ÿ‡ต๐Ÿ‡ฆ
PE ๐Ÿ‡ต๐Ÿ‡ช
S ๐Ÿ‡จ๐Ÿ‡ฆ ๐Ÿ‡ฒ๐Ÿ‡ฝ
SG ๐Ÿ‡ธ๐Ÿ‡ฌ
Column 2 Rate of Duty6%
Quota QuantityN/A
Additional DutiesN/A

Overview

This HTS category, 7410.22.00.00, specifically classifies copper foil that is backed with materials such as paper, paperboard, plastics, or similar backing substances. The critical defining characteristic of this foil is its thickness, which must not exceed 0.15 mm, excluding the thickness of any backing material. This classification applies regardless of whether the foil is printed or decorated.

It's important to distinguish this category from its sibling, 7410.21, which covers unbacked copper foil meeting the same thickness and material specifications. While both deal with thin copper foil, the presence of a backing material is the sole determinant for classification under 7410.22.

As this is a leaf node in the HTS structure, there are no further subcategories. Therefore, the classification is definitively determined by the presence of a backing material and the specified thickness, encompassing a range of applications where copper foil is integrated with other substrates for enhanced functionality or handling.

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