7410.21.30.60 - Other

This HTS category, 7410.21.30.60, specifically covers "Other" copper clad laminates. These are composite materials featuring a layer of copper bonded to a substrate, where the substrate is not exclusively plastics impregnated glass, distinguishing them from the sibling category that requires a base wholly of such material. The copper layer is typically electrolytically deposited or rolled onto the base material.

The defining characteristic of this classification lies in the composition of the base material beneath the copper. Unlike other sections of the HTS that might detail specific types of laminates based on their dielectric properties or intended use, this subcategory acts as a residual for copper clad laminates that do not fit into more specific classifications. This implies the base material could be comprised of various materials such as paper, epoxy resins, phenolic resins, or other polymers, provided it is not exclusively plastics impregnated glass.

As this is a leaf node, there are no further subcategories to detail. Classification under this HTS code is determined by the presence of a copper layer bonded to a substrate that does not meet the specific criteria of the sibling category for copper clad laminates with a wholly plastics impregnated glass base. The thickness of the copper foil itself is also a factor, aligning with the broader scope of Chapter 74 which addresses copper foil not exceeding 0.15 mm in thickness.